Production method of printed circuit board

Details Production method of printed circuit board Production method of printed circuit board

2006-03-07

2006-03-07

Chang, Rick Kiltae (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000

Reexamination Certificate

active

07007379

ABSTRACT:
The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layer2is formed in a given pattern on one surface of a supporting substrate1, a circuit pattern6is formed on the insulating layer2while forming a dummy pattern7in an area free of the insulating layer2on the one surface of the supporting substrate1, and an unnecessary part of the supporting substrate1, which is free of the insulating layer2and the circuit pattern6, is removed by dissolution together with the dummy pattern7.

REFERENCES:
patent: 3932932 (1976-01-01), Goodman
patent: 5120384 (1992-06-01), Yoshimitsu et al.
patent: 5633532 (1997-05-01), Sohara et al.
patent: 6317948 (2001-11-01), Kola et al.
patent: 6571467 (2003-06-01), Haze et al.
patent: 09-260844 (1997-10-01), None
patent: 2001-101637 (2001-04-01), None
patent: 2001-185849 (2001-07-01), None

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