Production method of multilayer electronic device

Details Production method of multilayer electronic device Production method of multilayer electronic device

2003-12-26

2009-02-17

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089160, C156S233000, C156S235000, C156S241000

Reexamination Certificate

active

07491283

ABSTRACT:
At the time of pressing an electrode layer12aagainst a surface of a green sheet10ahaving a thickness of 3 μm or thinner to bond the electrode layer12awith the surface of the green sheet10a, an adhesive layer28having a thickness of 0.02 to 0.3 μm is formed on a surface of the electrode layer12aor the surface of the green sheet10a. It is possible to easily transfer a dry type electrode layer to the surface of the green sheet with high accuracy without breaking or deforming the green sheet.

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