Production method of multilayer electronic device

Details Production method of multilayer electronic device Production method of multilayer electronic device

2008-03-18

2008-03-18

Mayes, Melvin (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089160

Reexamination Certificate

active

07344612

ABSTRACT:
A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet10aincluding at least a ceramic powder on a supporting body20; forming an electrode pattern layer12aon a surface of the lower side green sheet; forming a green chip by stacking multilayer units U1including at least the lower side green sheet and an electrode pattern layer; and firing the green chip; wherein the lower side green sheet10aformed on the supporting body20includes a binder of a curable resin, and the curable resin in the lower side green sheet10ais cured before forming said electrode pattern layer12aon the lower side green sheet.

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