Production method of circuit board module

Details Production method of circuit board module Production method of circuit board module

2005-09-13

2005-09-13

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C029S830000

Reexamination Certificate

active

06942745

ABSTRACT:
The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 μm to 50 μm. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.

REFERENCES:
patent: 5592365 (1997-01-01), Sugimoto et al.
patent: 6255138 (2001-07-01), Haishima
patent: 2 345 201 (2000-06-01), None
patent: 1-251787 (1989-10-01), None
patent: 4-211195 (1992-08-01), None
patent: 5-191008 (1993-07-01), None
patent: 8-46314 (1996-02-01), None
patent: 10-284818 (1998-10-01), None

Affiliated with

Also associated with

Rating

Production method of circuit board module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Production method of circuit board module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Production method of circuit board module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3414651