Production method of a wired circuit board

Details Production method of a wired circuit board Production method of a wired circuit board

2011-07-05

2011-07-05

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C174S260000

Reexamination Certificate

active

07971353

ABSTRACT:
A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern3including terminal portions6to connect with external terminals22of an electronic component21and criterion marks8to determine presence or absence of an inhibitory portion23that may be formed due to formation of an insulating cover layer4to inhibit connection between the terminal portions6and the external terminals22are formed on the insulating base layer2simultaneously, the insulating cover layer4to cover the conductive pattern3and an opening7from which the terminal portions6and the criterion marks8are exposed is formed. Thereafter, the presence or absence of the inhibitory portion23is determined with reference to the criterion marks8exposed from the opening7of the insulating cover layer4.

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