Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Patent
1996-05-14
1998-12-15
Hamilton, Cynthia
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From phenol, phenol ether, or inorganic phenolate
528100, 525438, 525444, 525451, 4302851, 522100, C08G 5916
Patent
active
058498575
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a photo-sensitive resin material suitable for a solder resist for producing a printed circuit board, an electroless plating resist, an insulating layer formed on a printed circuit board by a build-up method, and a black matrix and a color filter for producing a liquid crystal display, more specifically to a method for producing a photo-sensitive resin capable of forming a coated layer which has a high sensitivity to exposure to UV rays and a good developability in an alkaline aqueous solution and which has a less change with time in the developability and a cured coated layer which is excellent in electrical characteristics, mechanical characteristics, heat resistance, and chemical resistance, and a liquid photo-sensitive resin composition.
2. Description of the Related Art
In recent years, shifting IC and VLSI to higher densities has been accompanied with increasingly shifting a printed circuit board to a higher density and finer patterns and has necessitated a decrease in a circuit width and a circuit space. Accordingly, excellent accuracy of dimension and resolution have been required as well to a solder resist and an electroless plating resist more than ever.
In order to form a solder resist on a printed circuit board, there has generally been employed a method in which a heat-curable or photo-curable type resist ink is used to form patterns by screen printing and a transferred part is heat-cured or photo-cured. However, since the screen printing has limits in forming fine patterns, a progress of a printed circuit board to high density and minuteness has been accompanied with shifting to a developing type resist to which a principle of photo-imaging is applied. A dry film has been applied to a developing type resist-forming method at the beginning. However, because of a problem that bubbles are liable to be formed in compressing to a substrate, a liquid developing type resist in which coating method is not limited has been highlighted at present. In particular, an alkali developing type capable of being developed in a diluted weak alkaline aqueous solution has been mainly used in terms of an environmental measure, and carboxyl group-containing epoxy (meth)acrylate obtainable by reacting acid anhydride with epoxy (meth)acrylate obtainable by reacting an epoxy resin with (meth)acrylic acid to introduce the carboxyl group is used as a photo-sensitive resin for an alkali developing type resist (for example, Japanese Patent Laid-Open No. 61-243869 (U.S. Pat. No. 5,009,982) and Japanese Patent Laid-Open No. 63-258975).
In a method for forming patterns with a liquid developing type resist comprising a photo-sensitive resin composition suitable for a solder resist for producing a printed circuit board, an electroless plating resist, an insulating layer formed on a printed circuit board by a build-up method, and a black matrix and a color filter for producing a liquid crystal display, employed is a series of steps in which first of all, a resist is applied on a printed circuit board and dried by heating to form a coated layer, and then a pattern-forming film is compressed on this coated layer, followed by exposing and developing. However, there has been involved in this method, the problem that if tackiness remains on the coated layer after drying by heating in the steps described above, a part of the resist adheres to a pattern-forming film after peeling off, which makes it impossible to reproduce the patterns correctly or peel off the pattern-forming film. Accordingly, a tack-free property after forming a coated and dried layer is an important requisite characteristic for the liquid developing type resist.
Further, an alkali developability after exposing is an important characteristic as well. That is, in order to form fine patterns with a high reliability at a good reproducibility, an unexposed part of a coated layer has to be removed rapidly in developing. However, the alkali developability and the tack-free property des
REFERENCES:
patent: 4187257 (1980-02-01), Nielsen
patent: 4714751 (1987-12-01), Schornick et al.
patent: 4725524 (1988-02-01), Elzer et al.
patent: 5009982 (1991-04-01), Kamayachi et al.
Arakawa Motohiro
Awaji Toshio
Ohtsuki Nobuaki
Hamilton Cynthia
Nippon Shokubai Co. , Ltd.
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