Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-01-31
2006-01-31
Wilson, Christian (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S617000, C257S780000
Reexamination Certificate
active
06991965
ABSTRACT:
In a production method for manufacturing a plurality of chip-size packages, a plurality of semiconductor chip areas are defined on a surface of a wafer, each of the chip areas being produced as a semiconductor device having a plurality of electrode pads formed thereon. A plurality of sprout-shaped metal bumps formed on each device such that the respective metal bumps are bonded on the pads formed on a corresponding semiconductor device. A resin-sealing layer is formed on the surface of the wafer such that tips of the metal bumps formed on each of the devices are projected from a top surface of the resin-sealing layer. A plurality of wiring patterns are formed on the top surface of the resin-sealing layer such that each of the wiring patterns is allocated to a corresponding semiconductor device, and such that electrical connections are established between each of the wiring patterns and the tips of the metal bumps formed on the corresponding semiconductor device. A plurality of metal balls are formed on each of the wiring patterns such that electrical connections are established therebetween.
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Hayes & Soloway P.C.
NEC Electronics Corporation
Wilson Christian
LandOfFree
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