Production method for laminate type dielectric device and...

Details Production method for laminate type dielectric device and... Production method for laminate type dielectric device and...

2006-08-01

2006-08-01

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Metal compound containing

C252S512000, C252S519120, C252S519510, C252S500000, C252S06230R, C252S06230Q, C361S311000, C361S321200, C361S321500

Reexamination Certificate

active

07083745

ABSTRACT:
This invention provides a method of producing a laminate type dielectric device free from peeling of an electrode layer and a ceramic layer and from voids in both electrode layer and ceramic layer, and an electrode paste material. The invention relates also to an electrode paste material for constituting electrode layers of a laminate type dielectric device produced by at least the steps of alternately laminating ceramic layers11containing a lead element as a constituent component and electrode layers2, and degreasing and baking the laminate, wherein the electrode paste material contains CuO as a principal component of a starting material of an electrically conductive material, a solvent, a binder, and a cooperative material consisting of at least one kind of the main components constituting the ceramic layer11.

REFERENCES:
patent: 63-295491 (1988-12-01), None
patent: 03-048415 (1991-03-01), None
patent: 03-208831 (1991-09-01), None
patent: 05-174612 (1993-07-01), None
patent: 06-223621 (1994-08-01), None

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