Production method for insulated semiconductor device

Details Production method for insulated semiconductor device Production method for insulated semiconductor device

1997-03-04

1998-01-06

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437219, 437220, H01L 2160

Patent

active

057054312

ABSTRACT:
The invention provides a production method for an insulated semiconductor device which eliminates displacement between positions of upper and lower metallic mold cavities (between upper and lower caps) when a resin is filled to achieve improvement in quality and productivity. A lead shaping apparatus for shaping inner lead portions of a flat hoop frame supplied thereto from a frame supply apparatus is located between the frame supply apparatus and a die bonding apparatus so that, before die bonding of semiconductor pellets is performed, shaping of the inner lead portions is performed. Thereafter, die bonding and wire bonding are performed for the flat hoop frame, and then, resin is filled only into a lower metallic mold cavity by a resin filling apparatus to embed the inner lead portions in the resin.

REFERENCES:
patent: 5172214 (1992-12-01), Casto
patent: 5202288 (1993-04-01), Doering et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5409866 (1995-04-01), Sato et al.
patent: 5529959 (1996-06-01), Yamanaka

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