Production method for flexible printed board

Details Production method for flexible printed board Production method for flexible printed board

2005-10-04

2005-10-04

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

C205S125000, C205S187000, C205S210000

Reexamination Certificate

active

06951604

ABSTRACT:
A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.

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patent: 6495769 (2002-12-01), Saito et al.
patent: 2004/0170846 (2004-09-01), Seita et al.

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