Production method for electronic chip component

Details Production method for electronic chip component Production method for electronic chip component

2011-01-25

2011-01-25

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S834000, C257S623000

Reexamination Certificate

active

07874068

ABSTRACT:
A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

REFERENCES:
patent: 7667299 (2010-02-01), Mori et al.
patent: 2007/0227649 (2007-10-01), Onodera et al.
patent: 2 254 272 (1992-10-01), None
patent: 4-291712 (1992-10-01), None
patent: 2000-299145 (2000-10-01), None
patent: 2006-190864 (2006-07-01), None
patent: 2007-266208 (2007-10-01), None

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