Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-04-03
1999-09-07
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
059477512
ABSTRACT:
A test socket for ball grid array packages (BGA) for integrated circuits is described. The socket includes a basket or cradle shaped to receive the balls of the BGA in individual electrically conductive receptacles. The receptacles have flexible walls and an elastomer disposed outside the walls. The BGA, carrying the balls is urged in a direction parallel to the plane of the BGA thereby carrying the basket in the same direction. A stop is provided to limit the movement of the basket so that further movement of the BGA causes compression of the elastomer so as to provide an electrical connection between each ball and its associated receptacle despite any minor differences in the sizes or locations of the individual balls. Means are provided for connecting each of the receptacles to an external circuit.
REFERENCES:
patent: 2367512 (1945-01-01), MacFadden
patent: 5109320 (1992-04-01), Boudelaise et al.
patent: 5669774 (1997-09-01), Gabbe
patent: 5810607 (1998-09-01), Shih et al.
patent: 5829988 (1998-11-01), McMillan et al.
Abrams Neil
Duverne J. F.
VLSI Technology Inc.
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