Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1996-07-31
1997-09-02
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257665, H01L 2941, H01L 2362
Patent
active
056635907
ABSTRACT:
A process and resulting product are described for forming an integrated circuit structure with horizontal fuses on an insulation layer formed over other portions of the integrated circuit structure by forming rectangular recesses in the insulation layer which are subsequently filled during a subsequent metal deposition step which also serves to fill with the same metal vias or contact openings which have been etched through the insulation layer. Subsequent planarization of the deposited metal layer down to the vias or contact openings, i.e. to remove the portions of the metal layer over the insulation layer, leaves the metal in the vias or contact openings and also leaves metal stringers on the sidewalls of the rectangular recess which then serve as fusible links (fuses) which are then connected to one or more metal lines thereafter formed on the insulation layer.
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Jackson Jerome
LSI Logic Corporation
Taylor John P.
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