Product in tape form for supporting and conveying electronic com

Details Product in tape form for supporting and conveying electronic com Product in tape form for supporting and conveying electronic com

1988-10-19

1991-03-19

Davie, James W.

H01L 2348

Patent

active

050015443

ABSTRACT:
The produce comprises an electrically conductive tape cut out or etched so as to form windows from which connecting tabs for a chip project, according to the "single-layer" T.A.B. technology. An adhesive tape is glued to the conductive tape and pierced with windows centered on and lying within the conductive tape's windows. According to the invention, apertures isolate the connecting tabs for the purpose of applying test signals to the chip by means of the tabs then carried by the adhesive tape alone. The invention is used for testing integrated power circuits.

REFERENCES:
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4466183 (1984-08-01), Burns
patent: 4480150 (1984-10-01), Jones
patent: 4812421 (1989-03-01), Jung et al.
Patent Abstracts of Japan, vol. 10, No. 141.

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