Stock material or miscellaneous articles – All metal or with adjacent metals – Having variation in thickness
Patent
1993-04-02
1995-04-04
Zimmerman, John
Stock material or miscellaneous articles
All metal or with adjacent metals
Having variation in thickness
428687, 174261, B32B 330
Patent
active
054036712
ABSTRACT:
A printed circuit or hybrid circuit board with a formed solder deposit on a surface mount device (SMD) pad thereon, as well as for the formed solder deposit itself. This formed solder deposit is in a defined three-dimensional well having the proper profile and a defined solder gap. The solder before forming can be solid solder or a solder paste. By the placement of a mesh on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface on the other side of the mesh or on the mesh itself, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, then cooling the board to solidify the solder, a product results having the above properties. The duration of the application of heat and pressure is made so brief, that the laminate structure of the board and the coating thereon remain substantially unaffected.
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W. J. Maiwald "Reliable Reflow Soldering Techniques Using Preformed Solid Solder Deposits"-Part 2-The Assembly Process-no date.
M. Weinhold ". . . Part 1-The Printed Circuit Fabrication Process"-no date.
Holzmann Richard T.
Mask Technology, Inc.
Zimmerman John
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