Product for making isolated semiconductor structure

Details Product for making isolated semiconductor structure Product for making isolated semiconductor structure

1985-09-06

1986-12-23

Ozaki, George T.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29580, 148187, H01L 21461

Patent

active

046303430

ABSTRACT:
An integrated circuit structure comprises a plurality of islands of semiconductor material (16-1 through 16-5) each island being separated from adjacent islands by a groove formed in annular shape around said island to laterally define the dimensions of each such island, an oxide (12, 14) formed over the surface of said grooves (13-1 through 13-6) and said islands and a selected glass (15) deposited on said oxide (14) in the grooves and over the top surface of said device, said glass having the property that it flows at a temperature beneath the temperature at which dopants in the islands of semiconductor material substantially redistribute, said selected glass (15) having a substantially flat top surface thereby to give said structure a substantially flat top surface.

REFERENCES:
patent: 3415680 (1968-12-01), Perri et al.
patent: 3542572 (1970-11-01), Dalton et al.
patent: 3793068 (1974-02-01), Pammer
patent: 4281448 (1981-08-01), Barry et al.
patent: 4284659 (1981-08-01), Jaccodine et al.
patent: 4417914 (1983-11-01), Lehrer
patent: 4455325 (1984-06-01), Razouk
Li et al., IBM TDB, vol. 19, No. 11, Apr. 1977.
Gardiner et al., IBM Technical Disclosure Bulletin, "Fabricating Monolithic Circuits", vol. 10, No. 5, Oct. 1967, pp. 655 and 666.

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