Producing method of flexible wired circuit board

Details Producing method of flexible wired circuit board Producing method of flexible wired circuit board

2008-01-29

2008-01-29

Nguyen, Nam (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

C205S125000, C205S130000, C205S138000, C156S230000, C174S254000

Reexamination Certificate

active

07323093

ABSTRACT:
A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern3on a surface of the elongate substrate1by the semi-additive process using electrolysis plating and then annealing the elongate substrate1with the conductive pattern3in its wound up state, a stiffener sheet9having a width narrower than the elongate substrate1is bonded to the back side of the elongate substrate1.Thereafter, an oxidized film formed on a surface of the conductive pattern3is removed and then a solder resist11is formed thereon. This prevents the strip of the stiffener sheet9from the elongate substrate1and in turn prevents etching solution or developing solution from entraining in a gap therebetween.

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