Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
1999-09-10
2001-06-05
Ryan, Patrick (Department: 1725)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S179100
Reexamination Certificate
active
06241143
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the invention
The present invention generally relates to a method for producing a film-type transmission line and a method for connecting the line, and more particularly to a reduction of impedance irregularity at a junction of a transmission line.
2. Description of the Related Art
FIG. 1
shows a conventional constitution of a junction between a film substrate and a high-dielectric substrate in a high-frequency circuit of such a radar system. Prior art generally attempts to perform ribbon bonding using a gold ribbon. A film substrate
101
and a substrate of high permittivity
102
(e.g. ceramic) are constituted of transmission line patterns
103
and
104
respectively. The film substrate
101
is placed over the substrate of high permittivity
102
and a gold ribbon
105
lying astride both of the substrates is crimped through thermocompression bonding.
A method of connection of this type is shown in Japanese Patent Laid-Open Publication No. Hei 7- 170115. In
FIG. 1
of the patent document, the antenna pattern
11
(A) on a film substrate
11
is connected to a circuit pattern
14
through a gold ribbon
17
.
The connection through a ribbon in the prior art has disadvantages that a characteristic-impedance irregularity occurs at each junction, reflection of a signal is relatively high, and transmission loss is significant. In addition, the film substrate
101
and the substrate of high permittivity
102
are required to overlap one another as shown in
FIG. 1
, which causes a disadvantage of developing an impedance irregularity on an overlapped area.
Turning the film substrate
101
upside down allows patterns of both of the substrates to be connected by positioning them opposite to each other, in a face connection. As a result of this, the impedance irregularity may be reduced. However it is required to perform a bonding process through the medium of the film substrate
101
or the substrate of high permittivity
102
so that a disadvantage of lowered connecting force arises.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a method for producing a film-type transmission line and a method of connection being capable of easily constituting a connection with reduced impedance irregularity.
In order to achieve this object, according to the method for producing a film-type transmission line of the present invention, a transmission line pattern is first constituted on a film substrate. The film substrate is then partially removed with the remaining substrate constituting the transmission line pattern. As a result, a part where the transmission line pattern is exposed from the film substrate is formed as an exposed connecting portion to connect another transmission line.
The transmission line pattern produced through the aforementioned method is connected to a transmission line on a side to be connected by the following method. The film-type transmission line is placed in such a manner that the exposed connecting portion overlaps the transmission line pattern on a side to be connected. Bonding for the overlapped portion is then processed from a side of the exposed connecting portion.
As the exposed connecting portion is thus provided according to the present invention, connection between mutual pattern faces may be constituted by overlapping the exposed connecting portion and the transmission line pattern on a side to be connected. A ribbon is not used and there is no necessity to overlap the film substrate on the substrate to be connected. This allows any impedance irregularity to be reduced. In addition, a high reliability connection is capable of being constituted easily because bonding processing is not applied on the medium of the film substrate but directly on the exposed connecting portion, where is an extended portion of the line pattern.
A method of connection of this invention preferably comprises steps of making gold or aluminum adhere on the exposed connecting portion of the film-type transmission line, overlapping the exposed connecting portion to which by gold or aluminum is adhered and the transmission line pattern of gold or aluminum formed on the high-dielectric substrate on the side to be connected, and performing thermocompression bonding or ultrasonic bonding. The adhesion processing at this point is, for example, plating, evaporation, or transcription bump processing, which will be described later. Generally, material used for the line pattern of the film-type transmission line is copper and material used for the line pattern of the high-dielectric substrate of ceramics, for example, is gold or aluminum. According to this invention, these patterns made by different kinds of material may be easily connected together.
REFERENCES:
patent: 3640764 (1972-02-01), Shevlin
patent: 4113578 (1978-09-01), Del Monte
patent: 4357750 (1982-11-01), Ostman
patent: 4912547 (1990-03-01), Bilowith et al.
patent: 5274195 (1993-12-01), Murphy et al.
patent: 5557695 (1996-09-01), Yamane et al.
patent: 5726480 (1998-03-01), Pister
patent: 5904499 (1999-05-01), Pace
patent: 5915752 (1999-06-01), DiStefano et al.
patent: 5992326 (1999-11-01), Martinez-Tovar et al.
patent: 7-170115 (1995-07-01), None
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Johnson Jonathan
Ryan Patrick
Toyota Jidosha & Kabushiki Kaisha
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