Plastic and nonmetallic article shaping or treating: processes – Utilizing heat releasable stress to reshape solid workpiece
Patent
1991-01-30
1992-10-06
Thurlow, Jeffery
Plastic and nonmetallic article shaping or treating: processes
Utilizing heat releasable stress to reshape solid workpiece
2642358, 2642896, 264342RE, 264346, B29C 6102
Patent
active
051529467
ABSTRACT:
Biaxially oriented film is post-treated by an annealing process in a limited temperature range of 45.degree. C. to 120.degree. C. for various time periods based on the temperature for annealing in order to produce a film having less than a 0.2% shrinkage in the machine direction as measured at 51.7.degree. C. for 24 hours. This film has a wide range of uses, such as overwrapping film.
REFERENCES:
patent: 3361728 (1968-01-01), Coen et al.
patent: 3508944 (1970-04-01), Henderson et al.
patent: 3570052 (1972-07-01), Reade
patent: 3632733 (1972-01-01), Yazawa
patent: 3671383 (1972-06-01), Sakata et al.
patent: 4343852 (1982-08-01), Isaka et al.
patent: 4390385 (1983-06-01), Ferguson et al.
patent: 4415523 (1983-11-01), Barham et al.
patent: 4436888 (1984-03-01), Copple
patent: 4597920 (1986-07-01), Golike
patent: 4649009 (1987-03-01), Shibata et al.
patent: 4652409 (1987-03-01), Leese et al.
patent: 4652490 (1987-03-01), Arita et al.
JP 74-014-343 Toray Industries (filed Jun. 2, 1970 as 046856/70 Publ. Apr. 6, 1974 "Biaxially Oriented Polypropylene Composite Film".
JP 82-034-084 Tokuyama Soda KK (filed Dec. 28, 1972 as 66967/72, Publ. Jan. 17, 1975 as JP 50-004-161 as "Elastic Polyolefin Films".
Crowe John E.
Edwards David
Hercules Incorporated
Thurlow Jeffery
LandOfFree
Producing low shrink packaging film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Producing low shrink packaging film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Producing low shrink packaging film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1187505