Producing integrated circuit chips with reduced stress effects

Details Producing integrated circuit chips with reduced stress effects Producing integrated circuit chips with reduced stress effects

1989-10-18

1991-06-25

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, 437219, 437231, 437227, H01L 2160, H01L 2156

Patent

active

050266675

ABSTRACT:
Wire-bonded IC chips are coated with siloxane polyimide and cured to a hardened state. The coating is applied over portions of the circuitry which are stress-sensitive. The coating is spaced away from the wire-bond regions of the chip. Thereafter, the coated chip is plastic encapsulated in conventional fashion.

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