Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-05-26
2001-03-27
Gandhi, Jayprakash N. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S753000, C361S759000, C361S801000, C361S802000, C361S807000, C211S041170, C070S058000, C024S544000
Reexamination Certificate
active
06208523
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to electronic systems. More particularly, the invention relates to a processor retention mechanism.
BACKGROUND OF THE INVENTION
A current trend in the microprocessor industry is the use of “slot” type processors. A slot type processor has a microprocessor core mounted onto a printed circuit board (PCB) having an edge finger connection. The board is inserted vertically into a slot type connector, such as the 242-pin slot one connector.
An example of such a processor is the Pentium II processor manufactured by the Intel Corporation.
FIG. 1
illustrates a slot one type processor module
100
connected to a heat sink
102
. This processor module
100
is otherwise known as a single edge contact (SEC) cartridge. The outer cover of the processor module
100
has two locking latches
104
a
-
104
b
that are used to latch the processor module
100
to a retention frame.
FIGS. 2-3
illustrate the processor module
100
positioned in a retention frame
106
that is mounted to a PCB
108
.
FIG. 2
illustrates the assembled processor module
100
and heat sink
102
mounted with all its mechanical support structures.
FIG. 3
shows each of the mechanical support structures used to position the processor module
100
onto the PCB
108
. There is shown the processor module
100
positioned into a retention frame
106
that is mounted on a PCB
108
which surrounds a slot one connector
110
. Four mounting holes
112
a
-
112
d
are needed to attach the retention frame
106
to the PCB
108
. The retention frame
106
allows the processor module
100
to be positioned in a vertical upright position. The locking latches
104
are used to latch the processor module
100
into the retention frame
106
so that the processor module
100
remains connected to the slot one connector
110
on the PCB
108
.
A heat sink
102
is secured into a heat sink support structure
114
,
116
in order to minimize damage to the PCB
108
or the electronic components mounted thereon during mechanical shock and vibration. The heat sink support structure includes a heat sink support base
114
and a heat sink support top bar
116
. The bottom portion of the heat sink
102
is positioned between the heat sink support base
114
and the heat sink support top bar
116
. The heat sink support structure
114
,
116
is mounted onto the PCB
108
with two additional mounting holes
118
a
-
118
b.
The placement of the processor module
100
into the retention frame
106
consists of two main actions. First, the processor module
100
is inserted in a downward direction into the retention frame
106
and the slot one connector
110
. Next, the heat sink
102
is slid into the heat sink support structure so that the bottom portion of the heat sink
102
is positioned between the heat sink support base
114
and the heat sink support top bar
116
.
This type of a mechanical support structure has several disadvantages. It is a costly device since it consists of several parts including the retention frame
106
, the heat sink support base
114
, and the heat sink support top bar
116
. In addition, assembly of the device onto the PCB requires the additional step of securing the heat sink to the heat sink support structure.
Furthermore, the mechanical support structure requires six mounting holes
112
a-d
,
118
a
-
118
b
to mount each processor module
100
. In the event where multiple processor modules
100
are mounted onto the same PCB
108
, a considerable amount of space is used for the mounting holes which may not be available on the PCB
108
.
Additionally, the retention frame is dependent on the locking latches positioned on the processor module in order to secure it into the slot one connector. As such, the retention frame does not have a mechanism for securing the processor module to the connector and relies on the locking latches that are part of the processor module. In addition, the retention frame cannot support processor modules that do not have locking latches. Accordingly, there is a need for a processor retention device that overcomes these problems.
SUMMARY OF THE INVENTION
The present invention pertains to a circuit board retention assembly that can house one or more circuit boards mounted to a connector. In a first embodiment, the present invention pertains to a processor retention assembly that can house one or more processor modules having an edge finger connection. The processor retention assembly is positioned on a PCB surrounding one or more slot type connectors. The processor retention assembly is used to support the processor modules that are vertically mounted into the slot type connectors.
The processor retention assembly includes a rectangular-like cage having two parallel side panels. Each side panel has a set of processor rails that are used to house a processor module. There are two processor rails for each processor module and they are positioned on each side panel such that each edge of the processor module fits into a respective processor rail. Each edge of the processor module is slid along a respective processor rail and inserted into a slot connector.
The processor module is then securely fastened to the cage by means of two lock levers. There are two such lock levers for each processor module. The lock levers are positioned on opposite sides of the processor module and along the respective processor rails. The lock levers are used to securely fasten a processor module into the connector on the PCB and to securely fasten the processor module to the cage. In this manner, the processor module can withstand mechanical shock and vibration and avoid considerable damage to the processor module, the PCB, and the electronic components mounted thereon.
Each lock lever can be positioned in either the lock position or in the release position. In the lock position, the processor module is mounted into the slot connector and secured to the processor retention assembly. In the release position, the processor module is ejected from the slot one connector and released from the processor retention assembly.
Each lock lever has an ejector handle, a handle lock, and an ejector lever. The ejector handle allows a user to easily maneuver the lock lever into the lock or release position. The handle lock is the locking mechanism that secures the processor module to the processor retention assembly. The ejector lever is placed at the bottom of the processor module and is used to eject the processor module from the slot one connector and from the processor retention assembly.
The lock levers are beneficial since they provide a retention mechanism that can securely fasten any type of processor module to the processor retention assembly. The lock levers alleviate the need for the processor module to have such a retention mechanism. As such, the processor retention mechanism is not dependent on the processor module having a retention mechanism and can be used to house various types of processor modules or edge finger connection devices, including those having a locking mechanism.
REFERENCES:
patent: 5162979 (1992-11-01), Anzelone et al.
patent: 5708563 (1998-01-01), Cranston, III et al.
patent: 5829601 (1998-11-01), Yurchenco et al.
patent: 5831821 (1998-11-01), Scholder et al.
patent: 5856910 (1999-01-01), Yurchenco et al.
HP NetServer E 60, LC 3, LH 3/3r, and LPr Processor Upgrade Installation Guide, pp. 1-33, Mar. 1999, Hewlett-Packard; HP Part No. 5969-0074.
Intel, “Mechanical Assembly and Customer Manufacturing Technology for S.E.C. Cartridge Processors” (Application Note); Jul. 1997; pp. 1-53.
Bertolami Gwen M.
Pham Hoa
Gandhi Jayprakash N.
Hewlett--Packard Company
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