Processor module mounting assembly and a method of use

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S697000

Reexamination Certificate

active

07038914

ABSTRACT:
A computer assembly is disclosed. The computer assembly comprises a chassis and a mounting module rigidly coupled to the chassis. The mounting module is for cooling the computer assembly when in operation. The computer assembly includes at least one circuit board suspended from the module. The at least one circuit board has a known orientation relative to the module and the at least one circuit board has a variable orientation relative to the chassis. A system and method in accordance with the present invention provides a stable mounting for the cooling system that includes a large heat sink. The method and system in accordance with the present invention prevents the disturbance of the critical alignment of the printed circuit board with the heatsink from shock and vibration loading. The system and method in accordance with the present invention provides features that ensure full and consistent engagement of the high density signal connectors, while preventing damage to these fragile components in installation and service. Finally, the system and method in accordance with the present invention provides a quick and easy means of assembly of the system, to enable secure reliable interconnection of the printed circuit board with the suspended circuit board (daughter board), while supporting the cooling system heatsink.

REFERENCES:
patent: 6331937 (2001-12-01), Bartyzel
patent: 6384331 (2002-05-01), Ku
patent: 6460170 (2002-10-01), Shaeffer et al.
patent: 6542366 (2003-04-01), Davis et al.
patent: 6549410 (2003-04-01), Cohen
patent: 2003/0011986 (2003-01-01), Ariga
patent: 2003/0129863 (2003-07-01), Alcoe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Processor module mounting assembly and a method of use does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processor module mounting assembly and a method of use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processor module mounting assembly and a method of use will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3610276

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.