Processor module for system board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S690000, C361S699000, C361S701000, C361S707000, C361S715000, C361S721000

Reexamination Certificate

active

11021504

ABSTRACT:
Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

REFERENCES:
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patent: 6304450 (2001-10-01), Dibene et al.
patent: 6356448 (2002-03-01), DiBene et al.
patent: 6452113 (2002-09-01), Dibene et al.
patent: 6452804 (2002-09-01), Dibene et al.
patent: 6771507 (2004-08-01), Belady et al.
patent: 6816378 (2004-11-01), Belady et al.
patent: 6819562 (2004-11-01), Boudreaux et al.
patent: 7005586 (2006-02-01), Duley
David A. Klein, U.S. Appl. No. 10/800,837, filed Mar. 15, 2004, entitled “Multi-Processor Module”.

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