Static information storage and retrieval – Interconnection arrangements
Patent
1997-07-29
1999-02-02
Nguyen, Viet Q.
Static information storage and retrieval
Interconnection arrangements
361760, 361761, 361777, 361785, 361803, H03H 1100
Patent
active
058674195
ABSTRACT:
A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapted to be removably attached to a mother board. In so doing, the present PIMM is removably attachable to a mother board.
REFERENCES:
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5272664 (1993-12-01), Alexander et al.
patent: 5315482 (1994-05-01), Tanaka et al.
patent: 5317344 (1994-05-01), Beaman et al.
patent: 5383787 (1995-01-01), Switky et al.
patent: 5400003 (1995-03-01), Kledzik
patent: 5400220 (1995-03-01), Swamy
patent: 5412538 (1995-05-01), Kikinis et al.
patent: 5432913 (1995-07-01), Smits et al.
patent: 5446960 (1995-09-01), Isaacs et al.
patent: 5462442 (1995-10-01), Umemura et al.
patent: 5535342 (1996-07-01), Taylor
patent: 5574627 (1996-11-01), Porter
patent: 5687109 (1997-11-01), Protigal et al.
patent: 5708297 (1998-01-01), Clayton
patent: 5710733 (1998-01-01), Chengson et al.
IBM,Inc., "High Performance Package," IBM Technical Disclosure Bulletin, vol. 28, No. 3, pp. 1020-1021, Aug. 1985.
Kurt Paquin, "Thermally Activated Attachment Mechanism," Motorola Technical Developments, vol. 18, pp. 173-175, Mar. 1993.
IBM,Inc., "Novel Memory Card," IBM Technical Disclosure Bulletin, vol. 37, No. 10, pp. 505-508, Oct.1984.
Agarwala Unmesh
Chengson David P.
Foster Alan D.
Manton John C.
Mira Ali
Nguyen Viet Q.
Silicon Graphics Inc.
LandOfFree
Processor-inclusive memory module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Processor-inclusive memory module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processor-inclusive memory module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1123542