Processor heat sink retention module and assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S718000, C257S718000, C257S719000

Reexamination Certificate

active

07133288

ABSTRACT:
A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and at least one keep out area exterior to the frame elements. The frame elements include at least one frame element extending at an oblique angle to another of the frame elements, and heat sink retention posts extend vertically upward from the frame elements.

REFERENCES:
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patent: 6525941 (2003-02-01), Lai
patent: 6542367 (2003-04-01), Shia et al.
patent: 6549412 (2003-04-01), Ma
patent: 6570763 (2003-05-01), McHugh et al.
patent: 6574109 (2003-06-01), McHugh et al.
patent: 6611431 (2003-08-01), Lee et al.
patent: 6646881 (2003-11-01), Lai et al.
patent: 6654254 (2003-11-01), Szu et al.
patent: 6778396 (2004-08-01), Liu
patent: 6826052 (2004-11-01), Ma
patent: 6854993 (2005-02-01), McHugh et al.
patent: 2004/0105236 (2004-06-01), Lee et al.

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