Processing thin wafers

Details Processing thin wafers Processing thin wafers

2005-08-31

2009-11-03

Moore, Karla (Department: 1792)

Material or article handling

Process

Of moving material between zones having different pressures...

C414S217000, C414S935000, C414S936000, C414S939000, C414S941000, C156S345310, C156S345320, C118S719000, C118S733000

Reexamination Certificate

active

07611322

ABSTRACT:
There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

REFERENCES:
patent: 5174881 (1992-12-01), Iwasaki et al.
patent: 6238160 (2001-05-01), Hwang et al.
patent: 6251191 (2001-06-01), Matsuse
patent: 6667250 (2003-12-01), Sasaoka et al.
patent: 2004/0187791 (2004-09-01), Buse et al.

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