Processing system, processing method, and computer program

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Details

C700S029000, C700S030000, C700S282000, C427S008000, C118S665000, C118S697000

Reexamination Certificate

active

08055372

ABSTRACT:
The present invention provides a processing system, a processing method and a program, which can readily control a gas flow rate. A vertical-type heating apparatus1includes a plurality of gas supply pipes16to20each adapted for supplying a processing gas into a reaction vessel2configured to contain therein semiconductor wafers W. For the gas supply pipes16to20, flow rate control units21to25are provided, respectively, for controlling each flow rate. In a control unit50, processing conditions including the flow rate of the processing gas and a film thickness-flow rate-relationship model indicative of a relationship between the flow rate of the processing gas and a film thickness, are stored. The control unit50calculates the flow rate of the processing gas based on a process result obtained by processing the semiconductor wafers W under the processing conditions as well as on the film thickness-flow rate-relationship model, so as to process the semiconductor wafers W, while controlling the respective flow rate control units21to25, such that the flow rate of the processing gas will be changed into the calculated flow rate of the processing gas.

REFERENCES:
patent: 6913938 (2005-07-01), Shanmugasundram et al.
patent: 2010/0161103 (2010-06-01), Schaller et al.
patent: 5-308053 (1993-11-01), None
patent: 11-121389 (1999-04-01), None
patent: 3081969 (2000-06-01), None
patent: 2003-166066 (2003-06-01), None
patent: 2004-253493 (2004-09-01), None
Japanese Office Action mailed on Dec. 1, 2009 for Japanese Application No. 2007054092 with English translation.
Japanese Office Action issued on Feb. 17, 2009 with English translation.
Korean Office Action issued on Apr. 20, 2010 for Application No. 10-2008-19869 w/ English language translation.

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