Processing system

Details Processing system Processing system

1996-01-25

1996-11-19

Bueker, Richard

Coating apparatus

With vacuum or fluid pressure chamber

B05D 304

Patent

active

055758509

ABSTRACT:
In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. Gas is then supplied from a suitable pressure source via a pipe (17) into void (10), thereby to subject the workpiece to elevated pressure. Heating means may be provided to permit the workpiece to be subject to elevated temperature.

REFERENCES:
patent: 3599601 (1971-08-01), Ishikawa
patent: 4007706 (1977-02-01), Arvidsson
patent: 5194406 (1993-03-01), Bok

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