Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1995-02-17
1997-06-10
Tung, T.
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
216 66, H01L 2100
Patent
active
056371888
ABSTRACT:
An apparatus for processing substrates, the apparatus including a plurality of molecular dissociation furnaces. Each dissociation furnace produces a directed beam of neutral dissociated reactive species. Each reactive beam is directed at a surface of the semiconductor substrate. A photon source is also directed at the surface of the semiconductor substrate. The intensity and wavelength of the photon source are selected to enhance the reaction rate over that of the reactive beam acting alone on the surface.
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"New Molecular-dissociation furnace for H and O atom sources" by Bert Van Zyl and M.W. Gealy, Nov. 10, 1985, Review of Scientific Instruments 57 (3) .
Amme Robert C.
Van Zyl Bert
Colorado Seminary
Tung T.
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