Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2007-05-01
2007-05-01
Webb, Gregory (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C510S506000, C134S003000, C008S142000
Reexamination Certificate
active
10737203
ABSTRACT:
A dense cleaning fluid for removing contaminants from a substrate and a method comprising same is disclosed herein. In one embodiment of the present invention, the dense cleaning fluid comprises a dense fluid and at least one acetylenic diol or acetylenic alcohol surfactant.
REFERENCES:
patent: 4944837 (1990-07-01), Nishikawa et al.
patent: 4992308 (1991-02-01), Sunol
patent: 5013366 (1991-05-01), Jackson et al.
patent: 5158704 (1992-10-01), Fulton et al.
patent: 5236602 (1993-08-01), Jackson
patent: 5266205 (1993-11-01), Fulton et al.
patent: 5355901 (1994-10-01), Mielnik et al.
patent: 5370740 (1994-12-01), Chao et al.
patent: 5377705 (1995-01-01), Smith, Jr. et al.
patent: 5417768 (1995-05-01), Smith, Jr. et al.
patent: 5494526 (1996-02-01), Paranjpe
patent: 5522938 (1996-06-01), O'Brien
patent: 5533538 (1996-07-01), Marshall
patent: 5733964 (1998-03-01), Johnston et al.
patent: 5783082 (1998-07-01), DeSimone et al.
patent: 5789505 (1998-08-01), Wilkinson et al.
patent: 5866004 (1999-02-01), Houck et al.
patent: 5866005 (1999-02-01), DeSimone et al.
patent: 5868856 (1999-02-01), Douglas et al.
patent: 5872257 (1999-02-01), Beckman et al.
patent: 5873948 (1999-02-01), Kim
patent: 5908510 (1999-06-01), McCullough et al.
patent: 5944996 (1999-08-01), DeSimone et al.
patent: 5976264 (1999-11-01), McCullough et al.
patent: 6024801 (2000-02-01), Wallace et al.
patent: 6113708 (2000-09-01), Hopple et al.
patent: 6176895 (2001-01-01), DeSimone et al.
patent: 6224774 (2001-05-01), DeSimone et al.
patent: 6228563 (2001-05-01), Starov et al.
patent: 6240936 (2001-06-01), DeSimone et al.
patent: 6242165 (2001-06-01), Vaartstra
patent: 6270531 (2001-08-01), DeYoung et al.
patent: 6277753 (2001-08-01), Mullee et al.
patent: 6286231 (2001-09-01), Bergman et al.
patent: 6297206 (2001-10-01), Romack et al.
patent: 6306564 (2001-10-01), Mullee
patent: 6331487 (2001-12-01), Koch
patent: 6333268 (2001-12-01), Starov et al.
patent: 6344243 (2002-02-01), McClain et al.
patent: 6357142 (2002-03-01), Bergman et al.
patent: 6403544 (2002-06-01), Davenhall et al.
patent: 6454869 (2002-09-01), Cotte et al.
patent: 6500605 (2002-12-01), Mullee et al.
patent: 6506259 (2003-01-01), Romack et al.
patent: 6589355 (2003-07-01), Thomas et al.
patent: 2001/0023237 (2001-09-01), Bijl et al.
patent: 2002/0026729 (2002-03-01), Bergman et al.
patent: 2002/0055323 (2002-05-01), McClain et al.
patent: 2002/0088477 (2002-07-01), Cotte et al.
patent: 2002/0112747 (2002-08-01), DeYoung et al.
patent: 2003/0003762 (2003-01-01), Cotte et al.
patent: 2004/0055621 (2004-03-01), McDermott et al.
patent: 2004/0055624 (2004-03-01), McDermott et al.
patent: 2004/0068027 (2004-04-01), Daly et al.
patent: 2004/0144399 (2004-07-01), McDermott et al.
patent: 2005/0029490 (2005-02-01), Subawalla et al.
patent: 2005/0029492 (2005-02-01), Subawalla et al.
patent: 0 830 890 (1998-03-01), None
patent: 0 836 895 (1998-04-01), None
patent: 1 050 577 (2000-11-01), None
patent: 1 115 035 (2001-07-01), None
patent: 1 402 963 (2004-03-01), None
patent: WO 84/02291 (1984-06-01), None
patent: WO 99/49996 (1999-10-01), None
patent: WO 99/49998 (1999-10-01), None
patent: WO 99/61177 (1999-12-01), None
patent: WO 00/16264 (2000-03-01), None
patent: WO 00/26421 (2000-05-01), None
patent: WO 01/21616 (2001-03-01), None
patent: WO 01/32323 (2001-05-01), None
patent: WO 01/33613 (2001-05-01), None
patent: WO 01/60534 (2001-08-01), None
patent: WO 01/87505 (2001-11-01), None
patent: WO 02/11191 (2002-02-01), None
patent: WO 02/15251 (2002-02-01), None
patent: WO 02/66176 (2002-08-01), None
patent: WO 03/057811 (2003-07-01), None
patent: WO 2005/038898 (2005-04-01), None
K. Jackson, et al., “Microemulsions in Supercritical Hydrochlorofluorocarbons,” Langmuir 12(22), pp. 5289-5295 (1996).
M. A. Biberger, et al., “Photoresist and Photoresist Residue Removal with Supercritical CO2—A Novel Approach to Cleaning Wafers,” Semiconductor Fabtech, 12thEd., pp. 239-243.
D. Beery, et al., “Post Etch Residue Removal: Novel Dry Clean Technology Using Densified Fluid Cleaning (DFC),” IITC 99, pp. 140-142.
J. Liu, et al., “Investigation of Nonionic Surfactant Dynol-604 Based Reverse Microemulsions Formed in Supercritical Carbon Dioxide,” Langmuir 17, pp. 8040-8043 (2001).
K. Jackson, et al., “Surfactants and Microemulsions in Supercritical Fluids,” Supercritical Fluid Cleaning, pp. 87-120.
R. A. Bowling, et al., “Future Challenges for Cleaning in Advanced Microelectronics,” Texas Instruments slides.
H. J. Martinez, et al., “SCCO2—Is it an Enabling Technology for the 90nm Node and Beyond?” International SeMatech slides (2002).
S. Pawat, “Novel Wafer Clean Technologies,” International SeMatech slides (2001).
T. Hurd, et al., “scCO2Cleaning Applications in Porous ULK Processing,” Texas Instruments slides.
G. L. Weibel, et al., “Supercritical CO2in Microelectronics Processing,” Cornell University slides.
J. B. Rubin, et al., “Precision Cleaning of Semiconductor Surfaces Using Carbon Dioxide-Based Fluids,” Clarkson University, pp. 1-26.
G. Weibel, “Supercritical CO2for Semiconductor Applications,” Semiconductor Equipment and Materials International (2001).
J. Malloy, et al., “GC Analysis of Solvent Wash Samples,” Air Products and Chemicals, Inc. (2003).
Carpenter, B.A. et al., Supercritical Fluid Extraction and Chromatography,ACS Symposium Series 366, Apr. 5-10, 1987, Denver, CO.
Devittori, C. et al., Article at http://mpi.powerultrasonics.com/cleaning-co2,html, “Multifrequency ultrasonic Actuators with Special Application to Ultrasonic Cleaning in Liquid and Supercritical CO2”.
Enokida, Y. et al., “Ultrasound-Enhanced Dissolution of UO2 in Supercritical CO2 Containing a CO2-Philic Complexant of Tri-n-Butylphosphate and Nitric Acid”,Industrial&Engineering Chemistry Research, (2002), 41 (9), pp. 2282-2286.
Kretz Christine Peck
Parris Gene Everad
Rao Madhukar Bhaskara
Subawalla Hoshang
Air Products and Chemicals Inc.
Morris-Oskanian Rosaleen P.
Rossi Joseph D.
Webb Gregory
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