Processing of semiconductor components with dense processing...

Details Processing of semiconductor components with dense processing... Processing of semiconductor components with dense processing...

2007-09-11

2007-09-11

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

C134S001000, C134S001300, C134S011000, C134S012000, C134S031000

Reexamination Certificate

active

10737458

ABSTRACT:
Method for processing an article with a dense processing fluid in a processing chamber while applying ultrasonic energy during processing. The dense fluid may be generated in a separate pressurization vessel and transferred to the processing chamber, or alternatively may be generated directly in the processing chamber. A processing agent may be added to the pressurization vessel, to the processing chamber, or to the dense fluid during transfer from the pressurization vessel to the processing chamber. The ultrasonic energy may be generated continuously at a constant frequency or at variable frequencies. Alternatively, the ultrasonic energy may be generated intermittently.

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