Processing method utilizing an apparatus to be sealed...

Details Processing method utilizing an apparatus to be sealed... Processing method utilizing an apparatus to be sealed...

2006-08-29

2006-08-29

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C118S733000, C257SE21532

Reexamination Certificate

active

07098045

ABSTRACT:
A processing method is performed for processing a workpiece such as a semiconductor wafer. The processing method utilizes an apparatus comprising a cover for covering a portion of a surface, to be processed, of a workpiece, a process chamber formed by the cover and the surface, to be processed, of the workpiece, and a sealing portion provided between the cover and the surface of the workpiece for sealing the process chamber.

REFERENCES:
patent: 5938954 (1999-08-01), Onuma et al.
patent: 5997963 (1999-12-01), Davison et al.
patent: 6156625 (2000-12-01), Balamurugan
patent: 6187134 (2001-02-01), Chow et al.
patent: 6764386 (2004-07-01), Uziel
patent: 2002/0042246 (2002-04-01), Togawa et al.

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