Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2007-10-30
2007-10-30
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S669000, C438S676000
Reexamination Certificate
active
10436972
ABSTRACT:
A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
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Ikegami Hiroshi
Ito Shin'ichi
Kawano Kenji
Takahashi Riichiro
Takeishi Tomoyuki
Finnegan Henderson Farabow Garrett & Dunner LLP
Kabushiki Kaisha Toshiba
Tsai H. Jey
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