Processing method for wafer and processing apparatus therefor

Details Processing method for wafer and processing apparatus therefor Processing method for wafer and processing apparatus therefor

2007-03-27

2010-12-28

Tran, Binh X (Department: 1713)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C216S052000

Reexamination Certificate

active

07858530

ABSTRACT:
A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outwardly on a rear surface of the wafer. The processing method further includes: removing at least the projection of the peripheral reinforcing portion of the wafer; and transferring the wafer after the removing. In the removing, while the wafer is held on a holding table such that the rear surface of the wafer is exposed and the surface of the wafer closely contacts the holding table, at least the projection of the peripheral reinforcing portion is removed. After the removing of at least the projection, while the wafer is held on the holding table, a holding tape is applied to the rear surface of the wafer and the holding tape is supported by a frame. In the transferring, the wafer having the holding tape applied thereon is separated together with the frame from the holding table and is transferred together with the frame.

REFERENCES:
patent: 6527627 (2003-03-01), Arai
patent: 2005/0070072 (2005-03-01), Priewasser
patent: 2005/0250295 (2005-11-01), Mita
patent: 2006/0244096 (2006-11-01), Sekiya
patent: 10-233431 (1998-09-01), None
patent: 2002-299196 (2002-10-01), None
patent: 2004-281551 (2004-10-01), None
patent: 2005-123425 (2005-05-01), None
Office Action issued in corresponding Japanese Patent Application No. 2006-090235; issued Aug. 13, 2010 (3 pages).

Affiliated with

Also associated with

Rating

Processing method for wafer and processing apparatus therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processing method for wafer and processing apparatus therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing method for wafer and processing apparatus therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4201033