Photography – Fluid-treating apparatus – Fluid application to one side only of photographic medium
Reexamination Certificate
2003-05-09
2004-10-05
Rutledge, D. (Department: 2851)
Photography
Fluid-treating apparatus
Fluid application to one side only of photographic medium
C118S052000, C118S697000, C118S719000, C438S005000, C716S030000
Reexamination Certificate
active
06799910
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a processing method and a processing apparatus, in particular, a processing method and a processing apparatus for successively processing a plurality of workpieces such as glass substrates for liquid crystal display devices (LCD), semiconductor wafers, and so forth in different process conditions.
2. Description of the Related Art
Generally, when an LCD is produced, like in a semiconductor wafer producing process, a predetermined film is formed on an LCD glass substrate (hereinafter referred to as LCD substrate) as a workpiece. Thereafter, a photoresist solution is coated on the formed film. As a result, a resist film is formed. The resist film is exposed corresponding to a predetermined circuit pattern. Thereafter, a developing process is performed for the resist film. In such a manner, namely by so-called photolithography technology, the circuit pattern is formed.
In the photolithography technology, after a cleaning process is performed for an LCD substrate as a workpiece, a dehydration baking process is performed. Thereafter, an adhesion process (hydrophobic process) and then a cooling process are performed. Thereafter, the LCD substrate is transferred to a coating unit. In the coating unit, resist is coated on the LCD substrate. The resist-coated LCD substrate is transferred to a thermal process unit. In the thermal process unit, a thermal process (pre-baking process) is performed for the LCD substrate. As a result, moisture of the resist is evaporated. Thereafter, the LCD substrate is transferred to an exposing unit. In the exposing unit, an exposing process is performed for the LCD substrate. Thereafter, the LCD substrate is transferred to a developing unit. In the developing unit, a developing process is performed for the LCD substrate. Thereafter, the LCD substrate is transferred to a thermal process unit. In the thermal process unit, a thermal process (post-baking process) is performed for the LCD substrate. In such a sequence of processes, a predetermined circuit pattern is formed on the resist layer.
In the processes of the photolithography technology, since different types of resist films, insulating films, and so forth may be formed on the front surface of one LCD substrate, process solution supplying nozzles for a plurality of types of process solutions may be disposed in the coating unit. Depending on the purpose, a process solution for a resist film or an isolation film (planarizing film) is supplied from a predetermined process solution supplying nozzle to the LCD substrate. In such a manner, a thin film is formed on the LCD substrate.
In that case, after the coating process is performed, the temperature condition of a thermal process varies depending on the type of the process solution, the film thickness, and so forth. Thus, the thermal processes should be performed in different temperature conditions. Consequently, after a thermal process has been performed for LCD substrates of a lot to be processed first (hereinafter sometimes referred to as first lot), if a thermal process is performed for LCD substrates of a lot to be processed next (hereinafter sometimes referred to as second lot), it might be necessary to prepare two sets of thermal process units or change the temperatures of one thermal process unit for performing the thermal processes for workpieces of the two lots.
However, when two sets of thermal process units are prepared, the size of the entire units might become large. In addition, the facility cost of the units might rise. In particular, when LCD substrates that are becoming large year by year, which is a current tendency, are produced, the entire units become very large. In contrast, in the case that the temperatures of one thermal process unit are changed, although the size of the unit can be reduced, it might take a long time until a desired process temperature has been set. Thus, the process performance remarkably decreases.
SUMMARY OF THE INVENTION
The present invention has been made from the above-described point of view. An object of the present invention is to provide a processing method and a processing apparatus that allow a plurality of workpieces to be successively processed in different types of process conditions while the size reduction of the apparatus is kept.
To solve the forgoing problem, the present invention is a processing method, comprising the steps of (a) setting a first process portion for processing a plurality of workpieces for a first process condition; (b) after the step (a), causing the first process portion to process a first workpiece of the plurality of workpieces in the first process condition; (c) setting a second process portion for processing the plurality of workpieces for a second process condition; (d) after the step (c), causing the second process portion to process a second workpiece of the plurality of workpieces in the second process condition; (e) after the step (b) and during the step (d), changing and setting the first process portion for the second process condition; and (f) after the step (e), causing the first process portion to process a third workpiece of the plurality of workpieces in the second process condition.
According to the present invention, at the step (e), after the first workpieces have been processed in the first process portion while the second workpieces are being processed in the second process portion, the first process portion in which the first process condition has been set for the third process condition. By repeating such processes, a plurality of workpieces can be successively processed in different types of process conditions. In other words, after the second workpieces have been processed in for example the second process portion (after the step (d)), while the third workpieces are being processed in the first process portion (during the step (f)), the second process portion in which the second process condition has been set for the third process condition. In that case, the third process condition is different from the second process condition. However, the third process condition is not always different from the first process condition. In such a manner, the increase of the number of units is actively suppressed and the size reduction of the apparatus is kept. In addition, a plurality of workpieces can be successively processed in different types of process conditions.
According to the present invention, for example, the step (c) may be performed during the step (a) (or at the same time as the step (a)), after the step (a), or during the step (b). The first, second, and third workpieces are different objects.
According to one embodiment of the present invention, the step (c) is performed during the step (b). When the second process condition is set as late as possible, energy loss can be prevented. That is especially effective when the process of the second process portion is a thermal process.
According to the present invention, the step (b) has the step of (g) causing the first process portion to process the first workpiece as a workpiece contained in a first lot. The step (d) has the step of (h
1
) causing the second process portion to process the second workpiece as a workpieces contained in a second lot to be processed after the first lot. The step (f) has the step of (h
2
) causing the first process portion to process the third workpiece as a workpieces contained in the second lot to be processed after the first lot. According to the present invention, at least one of a plurality of workpieces contained in the first lot is processed in the first process portion. At least one of a plurality of workpieces contained in the second lot is processed in the second process portion. After the process of the first process portion has been completed, at least one of the plurality of workpieces contained in the second lot is processed in the first process portion. Thus, the present invention is very effective when workpieces are processed as a lot.
According to the present invention,
oblon, Spivak, McClelland, Maier & Neustadt, PC
Rutledge D.
LandOfFree
Processing method and processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Processing method and processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing method and processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3303453