Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-05-23
1995-09-12
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156327, 29829, 29846, 437925, 521918, B32B 3112, B32B 3114
Patent
active
054494273
ABSTRACT:
A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.
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Cole Herbert S.
Daum Wolfgang
Sitnik-Nieters Theresa A.
Wojnarowski Robert J.
Ball Michael W.
General Electric Company
Kratz Ann M.
Reed David W.
Snyder Marvin
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