Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-11-22
1998-07-28
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156327, 29829, 29846, 437925, B32B 3112, B32B 3114
Patent
active
057857873
ABSTRACT:
A method for fabricating a low dielectric constant printed circuit board includes dispersing an additive material in a low dielectric constant porous polymer layer; providing holes through the low dielectric constant porous polymer layer; applying a metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes; patterning the metallization layer; and removing the additive material from the low dielectric constant porous polymer layer. The removal of the additive material can be accomplished by sublimation, evaporation, and diffusion.
REFERENCES:
patent: 2012617 (1935-08-01), Munters
patent: 3576686 (1971-04-01), Schmidle et al.
patent: 3681186 (1972-08-01), Findlay et al.
patent: 3907623 (1975-09-01), Dowbenko
patent: 4751136 (1988-06-01), Kamiya et al.
patent: 5034801 (1991-07-01), Fishcher
patent: 5302547 (1994-04-01), Wojnarowski et al.
"Giants In Advanced Ceramics", Ceramic Industry, Aug. 1993, pp. 47-51.
"Dielectric Properties Measurement of Substrate and Support Materials" By Te-Kao Wu, Microwave and Optical Technology Letters, vol. 3, No. 8, Aug. 1990, pp. 283-286.
Handbook of Chemistry and Physics, 60th Ed., pp. C722-723.
"Fabrications of Controlled Porosity in a Tape Cast Glass Ceramic Substrate Material", 6046 Materials Letters, 1989 Aug., No. 8, Amsterdam, NL, pp. 278-282.
"Fabrication of Printed Circuit Wiring Boards Using Insulation Layers With Low Dielectric Constant", IBM Technical Disclosure Bulletin, vol. 31, No. 7, Dec. 1988, pp. 25-26.
"UV-Laser Photoblation of Thermostable Polymers:Polymides, Polyphenylquinoxaline and Teflon AF", Mat. Res. Soc. Symp. Proc. vol. 227, 1991 Materials Research Society, pp. 253-259.
Cole Herbert Stanley
Daum Wolfgang
Sitnik-Nieters Theresa Ann
Wojnarowski Robert John
Agosti Ann M.
General Electric Company
Lorin Francis J.
Snyder Marvin
LandOfFree
Processing low dielectric constant materials for high speed elec does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Processing low dielectric constant materials for high speed elec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing low dielectric constant materials for high speed elec will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-19708