Processing device

Details Processing device Processing device

2008-03-18

2008-03-18

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S737000, C257S719000

Reexamination Certificate

active

07345883

ABSTRACT:
A processing device is disclosed. It includes a heat dissipation plate structure with a thermally conductive material, and a processor with a major surface. The processor generates heat when energized, and the heat dissipation plate structure is adapted to dissipate heat from the processor. A heat dissipating material is in contact with the processor and the heat dissipation plate structure. Pins in an array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor. The pins may be received in a socket assembly that is on a circuit board.

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