Processing apparatus for substrates

Details Processing apparatus for substrates Processing apparatus for substrates

1997-11-06

1999-11-09

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118719, C23C 1600

Patent

active

059806842

ABSTRACT:
For shortening the time for introducing an inactive gas, such as nitrogen gas, into a load lock chamber of a processing apparatus for substrates, a buffer tank 19 having a capacity larger than that of the load lock chamber 3 is provided in the path of a pipe for introducing the nitrogen gas into the load lock chamber 3 of the processing apparatus. During processing within the processing chamber 2, such as an ashing process and so on, the nitrogen gas is introduced into the load lock chamber 3 from the buffer tank 19 by operating a valve mechanism 21 to increase the pressure within the load lock chamber 3 up to atmospheric pressure.

REFERENCES:
patent: 4433951 (1984-02-01), Koch
patent: 4503807 (1985-03-01), Nakayama

Affiliated with

Also associated with

Rating

Processing apparatus for substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processing apparatus for substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing apparatus for substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1450684