Processing apparatus for manufacturing semiconductors

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118500, 118728, 20429815, 269 21, C23F 102, C23C 1600, B05C 1300, B25B 1100, B25B 1300

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active

061396826

ABSTRACT:
A processing apparatus comprises a support for supporting a body to be processed within a processing chamber. The support is equipped with a lift for lifting said body and lowering the body. The lift includes a plurality of rods disposed in a plurality of cylinders formed through the support, respectively. Each of the plurality of rods has a piston for movement in one of the plurality of cylinders to produce reduced pressure in a space within the cylinder between the piston and the body resting on the support. An actuator is drivingly coupled with the plurality of rods to lower the rods against suction created due to reduced pressure in the spaces.

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Japanese Office Action dated Feb. 16, 1999, with partial translation.

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