Fluid handling – Systems – With pump
Patent
1990-04-13
1992-09-29
Rosenthal, Arnold
Fluid handling
Systems
With pump
251 62, 251205, 251326, 137565, F16K 332, F16K 31122
Patent
active
051507340
ABSTRACT:
An apparatus for processing semiconductor wafers at reduced pressure comprising a vacuum chamber and a pumping system connected with the chamber. The pumping system includes at least a roughing pump, an exhaust pipe connecting the chamber with the roughing pump and a valve inserted in the exhaust pipe for opening and closing gas flow therethrough. The valve comprises: a valve casing having valve inlet and outlet openings connected with the exhaust pipe; a valve seat comprising a gasket surrounding at least one of the openings and having a first surface; and a valve plug having a second surface, the second surface being parallel with the first surface and contacting airtightly with the gasket at a valve closed position, the valve plug being movable substantially in the direction of the first surface for closing and opening the valve, thereby causing the opening for gas flow to be opened or closed gradually by the movement of the second surface of the valve plug. The valve functions to gradually change its conductance during opening and closing operations.
REFERENCES:
patent: 4212317 (1980-07-01), Patrick et al.
patent: 4214730 (1980-07-01), Baumann
patent: 4776564 (1988-10-01), Westenberg
patent: 4798227 (1989-01-01), Goodwin
Fujitsu Limited
Rosenthal Arnold
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