Processing apparatus and processing method

Details Processing apparatus and processing method Processing apparatus and processing method

2011-08-23

2011-08-23

Zervigon, Rudy (Department: 1716)

Coating apparatus

Gas or vapor deposition

C156S345100, C251S331000, C251S335100

Reexamination Certificate

active

08002894

ABSTRACT:
In a processing apparatus including a diaphragm valve provided on a process gas discharge line for discharging a process gas from a processing chamber and configured to control the internal pressure of the processing chamber by adjusting the opening of the diaphragm valve, an antistatic agent source is connected to the process gas discharge line at a position upstream of the diaphragm valve. Damage of a diaphragm valve element due to spark discharge resulted from electric charge generated by friction between the gas flowing through the diaphragm valve and the diaphragm valve element can be prevented.

REFERENCES:
patent: 4795497 (1989-01-01), McConnell et al.
patent: 6176265 (2001-01-01), Takahashi et al.
patent: 6869499 (2005-03-01), Toshima et al.
patent: 7086410 (2006-08-01), Chouno et al.
patent: 2004/0002224 (2004-01-01), Chono et al.
patent: 2006/0079096 (2006-04-01), Nakamori et al.
patent: 2006/0099339 (2006-05-01), Hashizume
patent: 1 077 473 (2001-02-01), None
patent: 2000-262874 (2000-09-01), None
patent: 2003-332322 (2003-11-01), None
patent: 2004-273553 (2004-09-01), None
patent: 02/09894 (2002-02-01), None
European Search Report.
Japanese Office Action issued on Sep. 22, 2010 for Application No. 2006-154494 with English translation.

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