Processing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing

Reexamination Certificate

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Details

C156S073100, C156S580100, C156S580200

Reexamination Certificate

active

08074693

ABSTRACT:
A processing apparatus that performs processing on a workpiece continuous in a transport direction, and performs processing on the workpiece at a predetermined processing pitch in a rotational direction of a rotating body that rotates about an axis, includes: a first processing section that is disposed at a predetermined position in the rotational direction so as to oppose an outer circumferential face of the rotating body, second processing sections at each predetermined angle in the rotational direction on the outer circumferential face of the rotating body, which perform the processing on the workpiece in cooperation with the first processing section when a second processing section opposes the first processing section, and a support section that supports the workpiece between the second processing sections, and in which it is possible to change, depending on the processing pitch, a position at which the support section supports the workpiece.

REFERENCES:
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patent: 4713132 (1987-12-01), Abel et al.
patent: 7383865 (2008-06-01), Umebayashi et al.
patent: 7449084 (2008-11-01), Nakakado
patent: 2004/0035521 (2004-02-01), Nakakado et al.
patent: 2004/0112508 (2004-06-01), Umebayashi et al.
patent: 2005/0241751 (2005-11-01), Nakakado et al.
patent: 2006/0032589 (2006-02-01), Nakakado et al.
patent: 2006/0089615 (2006-04-01), Saito
patent: 1 393 701 (2004-03-01), None
patent: 1 428 487 (2004-06-01), None
patent: 1 795 164 (2007-06-01), None
patent: 2004-223238 (2004-08-01), None
patent: 2004-329873 (2004-11-01), None
patent: 2006-101970 (2006-04-01), None
patent: 2006-326313 (2006-12-01), None
patent: 2007-044374 (2007-02-01), None
PCT/JP2008/056658 International Search Report.

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