Processing a printed wiring board by single bath...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming multiple superposed electrolytic coatings

Reexamination Certificate

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C205S176000, C205S177000, C205S178000, C205S180000, C205S181000, C205S182000, C205S239000, C205S255000, C428S209000, C174S250000, C174S257000

Reexamination Certificate

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07846317

ABSTRACT:
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

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patent: 6331347 (2001-12-01), Haji
patent: 6503348 (2003-01-01), Poschmann

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