Processes of making two-sided printed circuit boards, with throu

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427423, 427404, 427282, 174 685, 264309, B05D 512

Patent

active

042633419

ABSTRACT:
Printed circuits, and techniques and materials for making printed circuits by prior-known metal-spraying techniques, particularly for making two-sided boards with metal through-hole connects. Preferably, a primer coating (40) of a metal such as zinc is sprayed onto one surface of the substrate, through a chrome-plated metal stencil (30), after which a conductive coating (13 or 16), such as copper or nickel, is sprayed onto the zinc coating to form the conductive patterns. Through hole connections (20) are fabricated by forming tapered holes (50), and placing a removable stop member (51) against the narrow end of the hole before spraying the patterns. The first pattern (16) is then sprayed on from the wide end of the hole (50) so that a portion (52) of the material coats the walls of the hole and forms a bridging strip (53) across the narrow end of the hole. After this, the stop (51) is removed, and the other side (14) is sprayed to form a conductive portion (16B) contacting the bridging strip (53) to make the through connect.

REFERENCES:
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patent: 3620933 (1971-11-01), Grunwald et al.
patent: 3648131 (1972-03-01), Stuby
patent: 3820994 (1974-06-01), Lindberg et al.
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patent: 4128680 (1978-12-01), Heaps et al.
patent: 4191789 (1980-03-01), Brown et al.
Norwood et al., Manufacturing Process for Hybrid Microcircuits Containing Vias, IEEE Transactions on Parts, Hybrids and Packaging, vol. PNP-1, No. 4, pp. 323-335, Dec. 1976.
Cook et al., IBM Tech. Dis. Bul., vol. 20, No. 2, (Jul. 1977).

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