Processes for manufacturing multilayer flexible wiring boards

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

Other Related Categories

C428S209000, C428S901000

Type

Reexamination Certificate

Status

active

Patent number

10028624

Description

ABSTRACT:
A process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

REFERENCES:
patent: 2014524 (1935-09-01), Franz
patent: 2911605 (1959-11-01), Wales, Jr.
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 3780431 (1973-12-01), Feeney
patent: 4681656 (1987-07-01), Byrum
patent: 5062916 (1991-11-01), Aufderheide et al.
patent: 6195881 (2001-03-01), Giardina et al.
patent: 6200824 (2001-03-01), Hashimoto
patent: 6320135 (2001-11-01), Saito
patent: 02-239695 (1990-09-01), None
Office Action of Chinese Patent Application No. 01145469.5 dated Aug. 20, 2004 (4 pages).
English translation of Chinese Office Action dated Aug. 20, 2004 for Chinese Patent Application No. 01145469.5 (3 pages).
English Abstract of Japanese Publication No. 02-239695 dated Sep. 2, 1990 (1 page).

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