Processes for forming exoergic structures with the use of a plas

Details Processes for forming exoergic structures with the use of a plas Processes for forming exoergic structures with the use of a plas

1989-02-17

1990-06-12

Silverman, Stanley

Stock material or miscellaneous articles

Composite

Of inorganic material

428697, 427 34, 427423, 427224, 427377, 427427, B32B 900, B05D 100

Patent

active

049332414

ABSTRACT:
Plasma spraying methods of forming exoergic structures and coatings, as well as exoergic structures produced by such methods, are provided. The methods include the plasma spraying of reactive exoergic materials that are capable of sustaining a combustion synthesis reaction onto a flat substrate or into molds of arbitrary shape and igniting said plasma sprayed materials, either under an inert gas pressure or not, to form refractory materials of varying densities and of varying shapes.

REFERENCES:
patent: 2943951 (1960-07-01), Haglund et al.
patent: 3344210 (1967-09-01), Silvia
patent: 3387110 (1968-06-01), Wendler et al.
patent: 3513044 (1970-05-01), Ishibashi
patent: 3523840 (1970-08-01), Bedell
patent: 3591759 (1971-07-01), Stund
patent: 3676638 (1972-07-01), Stund
patent: 3734983 (1973-05-01), Forsten et al.
patent: 3766820 (1973-10-01), Forster et al.
patent: 4092383 (1978-05-01), Reed, Jr.
patent: 4121083 (1978-10-01), Smith
patent: 4124663 (1978-11-01), Brumley et al.
patent: 4146654 (1979-03-01), Guyonset
patent: 4202641 (1980-05-01), Yurasho, Jr.
patent: 4445021 (1984-04-01), Irons et al.

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