Processes for fabricating printed wiring boards using...

Details Processes for fabricating printed wiring boards using... Processes for fabricating printed wiring boards using...

2005-03-15

2005-03-15

Nguyen, Nam (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S118000, C205S122000, C205S158000, C205S183000, C205S221000, C205S223000, C205S229000

Reexamination Certificate

active

06866764

ABSTRACT:
An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications. The process includes steps of depositing a radially-layered dendritic copolymer on selected surfaces of a dielectric substrate; cross-linking the radially-layered dendritic copolymer to form a dendritic polymer network; sorbing metal cations into the cross-linked dendritic polymer network; reducing the metal cations to form a nanocomposite composition exhibiting adequate surface electrical conductivity for electroplating; and electroplating a metal onto the nanocomposite composition to form an electrically conductive deposit.

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