Processes for adhesion-bonding between metallic materials and ga

Details Processes for adhesion-bonding between metallic materials and ga Processes for adhesion-bonding between metallic materials and ga

1989-02-02

1990-05-15

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 510

Patent

active

049255363

ABSTRACT:
Disclosed are electrolytes and processes for the metal-plating of metallic materials, and more specifically low-alloy high-strength steels, which processes are characterized in that adhesion-bonding layers of iron, iron and nickel, nickel, cobalt, copper or alloys of said metals or Sn-Ni alloys are electrodeposited on said metallic materials from non-aqueous electrolytes, and then aluminum is electrodeposited thereon in a per se known manner.

REFERENCES:
patent: 4721656 (1988-01-01), Vance
Plating, Nov., 1972, pp. 1048-1052.

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