Incremental printing of symbolic information – Thermal marking apparatus or processes – Specific resistance recording element type
Reexamination Certificate
2009-06-14
2011-10-04
Tran, Huan (Department: 2861)
Incremental printing of symbolic information
Thermal marking apparatus or processes
Specific resistance recording element type
Reexamination Certificate
active
08031217
ABSTRACT:
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process forms interconnect wires on a thermal decomposable adhesive, and after positioning the wires at proper bond pad locations, releases the interconnect wires onto the bond pads.
REFERENCES:
patent: 3689336 (1972-09-01), Bunker et al.
patent: 5489551 (1996-02-01), Castleberry
patent: 5731244 (1998-03-01), Evers
patent: 6946178 (2005-09-01), Sheats et al.
patent: 7141348 (2006-11-01), Sheats et al.
patent: 2010/0313414 (2010-12-01), Sheats
patent: 2010/0314718 (2010-12-01), Sheats
patent: 2010/0314719 (2010-12-01), Sheats
patent: 2010/0314734 (2010-12-01), Sheats
Nguyen Tue
Tran Huan
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